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Add fabricating instructions #3

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Kreyren opened this issue Jun 2, 2024 · 0 comments
Open

Add fabricating instructions #3

Kreyren opened this issue Jun 2, 2024 · 0 comments

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@Kreyren
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Kreyren commented Jun 2, 2024

These are missing and it's not a good practice to guestimate them (was a real pain to figure these out for teres pcbs for me):

  • BoardSpec: (IPC 6012 Class 2, IPC 6012 Class 3, IATF16949, ISO 13485, custom standard, etc..)
  • Material Type: (minimal, optimal and maximal TG for the FR4 board, halogen?, CTI?, special material?)
  • Material Thickness (0.2~3.2mm)

image

  • Min track/spacing: 3/3mm ~ 8/8mil
    image

  • Min hole size: (0.15 ~ 1.0mm)

  • Min Via hole size/diameter

  • Surface Finish (ENIG?)

  • Outer Copper Weight/Finished copper (0 oz to 20 oz of Cu)

  • Inner Copper Weight

  • Board Outline Tolerance

  • Via Covering (Tented, Epoxy Filled & Untented, Plugged, Epoxy Filled & Capped, Copper paste Filled & Capped)

Ideally in a form of minimal to maximal recommended, options that should not be used etc.. (i want to make custom PCBs with edge plating and high outer weight so that would help a lot ^-^)

* Options taken from own (no buried or blind vias) + local + EU + foreign
* For details to these options refer to jlcpcb or pcbway's instant quote forms.

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