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Copy pathMSOP-12-16-1EP-VIA_3x4mm_Pitch0.5mm.kicad_mod
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MSOP-12-16-1EP-VIA_3x4mm_Pitch0.5mm.kicad_mod
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(module "MSOP-12-16-1EP-VIA_3x4mm_Pitch0.5mm" (layer F.Cu) (tedit 5631AC3D)
(descr "10-Lead Plastic Micro Small Outline Package (MS) [MSOP] (see Microchip Packaging Specification 00000049BS.pdf)")
(tags "SSOP 0.5")
(attr smd)
(fp_text reference REF** (at 0 -3.35) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value "MSOP-12-16-1EP-VIA_3x4mm_Pitch0.5mm" (at 0 3.5) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -0.5 -2.0) (end 1.5 -2.0) (layer F.Fab) (width 0.15))
(fp_line (start 1.5 -2.0) (end 1.5 2.0) (layer F.Fab) (width 0.15))
(fp_line (start 1.5 2.0) (end -1.5 2.0) (layer F.Fab) (width 0.15))
(fp_line (start -1.5 2.0) (end -1.5 -1.0) (layer F.Fab) (width 0.15))
(fp_line (start -1.5 -1.0) (end -0.5 -2.0) (layer F.Fab) (width 0.15))
(fp_line (start -3.15 -2.6) (end -3.15 2.6) (layer F.CrtYd) (width 0.05))
(fp_line (start 3.15 -2.6) (end 3.15 2.6) (layer F.CrtYd) (width 0.05))
(fp_line (start -3.15 -2.6) (end 3.15 -2.6) (layer F.CrtYd) (width 0.05))
(fp_line (start -3.15 2.6) (end 3.15 2.6) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.675 -2.425) (end -1.675 -2.2) (layer F.SilkS) (width 0.15))
(fp_line (start 1.675 -2.425) (end 1.675 -2.125) (layer F.SilkS) (width 0.15))
(fp_line (start 1.675 2.425) (end 1.675 2.125) (layer F.SilkS) (width 0.15))
(fp_line (start -1.675 2.425) (end -1.675 2.125) (layer F.SilkS) (width 0.15))
(fp_line (start -1.675 -2.425) (end 1.675 -2.425) (layer F.SilkS) (width 0.15))
(fp_line (start -1.675 2.425) (end 1.675 2.425) (layer F.SilkS) (width 0.15))
(fp_line (start -1.675 -2.2) (end -2.9 -2.2) (layer F.SilkS) (width 0.15))
(fp_text user %R (at 0 0) (layer F.Fab)
(effects (font (size 0.6 0.6) (thickness 0.15)))
)
(pad 1 smd rect (at -2.2 -1.75) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
(pad 3 smd rect (at -2.2 -0.75) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
(pad 5 smd rect (at -2.2 0.25) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
(pad 12 smd rect (at 2.2 0.25) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
(pad 14 smd rect (at 2.2 -0.75) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
(pad 16 smd rect (at 2.2 -1.75) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
(pad 6 smd rect (at -2.2 0.75) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
(pad 7 smd rect (at -2.2 1.25) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
(pad 8 smd rect (at -2.2 1.75) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
(pad 11 smd rect (at 2.2 0.75) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
(pad 10 smd rect (at 2.2 1.25) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
(pad 9 smd rect (at 2.2 1.75) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
(pad 17 smd rect (at 0 0) (size 1.65 2.85) (layers F.Cu F.Paste F.Mask))
(pad 17 thru_hole circle (at 0 0) (size 0.65 0.65) (drill 0.25) (layers *.Cu *.Paste *.Mask))
(pad 17 thru_hole circle (at 0 1) (size 0.65 0.65) (drill 0.25) (layers *.Cu *.Paste *.Mask))
(pad 17 thru_hole circle (at 0 -1) (size 0.65 0.65) (drill 0.25) (layers *.Cu *.Paste *.Mask))
(model ${KISYS3DMOD}/Housings_SSOP.3dshapes/MSOP-12-16-1EP_3x4mm_Pitch0.5mm.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)