Circuit Progression (Electronic-Supracausal)

[swagXDragonSlayer46YT]

New machines

Molecular beam epitaxy (multiblock): requires extremely low vacuums (possibly provided by cryopumps that are a part of the multiblock) and very low temperatures. Both can be provided by liquid gases. Requires these blocks: https://en.wikipedia.org/wiki/Knudsen_cell

Source: https://en.wikipedia.org/wiki/Molecular-beam_epitaxy

PCBs

The general process is that copper is laminated onto a substrate before photolithography is used to create a pattern on the board.

Tier 4 circuit boards and above will require depositing additional metal on top of the copper tracks in a fiber reinforced epoxy board. Here are some materials, ranked from least advanced to most advanced. These materials may be applied by electroplating or soldering.

• Basic metals include solder, gold, nickel and silver
• Alloys including electrum & niobium-titanium
• Benzotriazole coating to protect copper
• Electroless plating: https://en.wikipedia.org/wiki/Electroless_nickel-phosphorus_plating. Used to apply nickel-phosphorous plating, as well as palladium

The Tier 5 circuit board (Fiber reinforced circuit board) will also require bromine to meet FR-4 circuit board specifications

The Tier 6 circuit board (Multi-layer circuit board) is created by laminating 2 Tier 5 Circuit Boards to a Tier 5 PCB in a forming press. This is turned into a printed circuit board by using photolithography on it again to get patterns on the outside layers.

More possible materials for PCB substrates, ranked from least advanced to most advanced.

• Graphene nanoribbons
• Boron nitride nanotubes
• Composites made from gems and polymers (https://en.wikipedia.org/wiki/Colloidal_crystal#Applications)
• Composites made from using ion implantation to embed nanoparticles in alumina substrate: https://en.wikipedia.org/wiki/Ion_implantation#Ion_implantation-induced_nanoparticle_formation

SOCs

SOCs would be based off of complex integrated circuits.

Use EUV lithography instead of usual UV lithography: https://en.wikipedia.org/wiki/Extreme_ultraviolet_lithography

Needs EUV lasers and silicon-molybdenum masks, along with other challenges

Nano CPU

Nano CPUs would be based off of CNFETs, which need carbon nanotubes:

Use warp-around gate CNFET method:

https://en.wikipedia.org/wiki/Carbon_nanotube_field-effect_transistor

Power ICs

PICs and anything more advanced would be based on Power MOSFETs

They would also use silicon-germanium wafers

https://en.wikipedia.org/wiki/Power_MOSFET

More advanced tiers: https://en.wikipedia.org/wiki/Power_semiconductor_device#Solid-state_devices

Electronic Components

Advanced SMDs will also be changed, rather than having HSS metals and random plastics being thrown together in an assembler. The new SMD recipes will be modelled after Memristors, 2D materials and Schottky diodes created from molecular epitaxy. These would require ultrapure elements.

• Advanced SMD resistor are made from extremely thin layer of titanium dioxide sandwiched between extremely thin layers of titanium and platinum.
• Advanced SMD capacitors are made from extremely thin layers of barium titanate sandwiched between extremely thin layers of titanium and platinum.
• Advanced SMD transistors are made by stacking an alumina layer on top of a silicene (2D silicon) layer on top of a silver layer.
• Advanced SMD diodes are made from n-doped silicon and platinum silicide, which is made from depositing a pure platinum layer onto silicon wafers and heating it in an inert atmosphere.
• Advanced SMD inductors are made from extremely thin layers of boron nitride sandwiched between extremely thin layers of gold and silver. Boron nitride chain is already implemented in GCYS.

Tiering up from processors to mainframes

Applies to micro circuits and anything above.

Upgrading from assemblies to supercomputers will require:

• Assemblies
• Frames instead of circuit boards
• Lots of RAM
• Lots of cables (not wires)
• NAND/NOR gates
• Diodes

Upgrading from supercomputers to mainframes will take place in a normal 9-slot assembler. They will require:

• Frames
• Supercomputers
• PICs
• Internal Batteries
• Lots of cables (not wires)
• Diodes
• Data Sticks/Data Orbs
• Optical Cables for data transfer
• Items for cooling (rotors? Coolant cells?)

Quantum Circuits

Copy spintronics from GCYS for quantum memory. Maybe borrow inspiration from quantum superconducting computing

Mercury cadmium telluride is grown using molecular beam epitaxy: https://en.wikipedia.org/wiki/Mercury_cadmium_telluride#HgCdTe_growth_techniques

Crystal Circuits

Based on crystal optics

Materials used for optic-based memory (based on https://en.wikipedia.org/wiki/5D_optical_data_storage)

• Fused quartz, made from melting and cooling quartz crystals in an inert atmosphere
• Gold and silver nanoparticles, which are embedded into the fused quartz
• Femtosecond laser items that are made from mediums that emit visible light (400 nm to 700 nm), which will be made from any medium that emits visible light, a few glass lenses, and periodically poled lithium niobate lens.

Materials used for optical processing unit:

• Nanowire lasers made from growing boron nitride and zinc oxide lasers on silicon wafers using molecular beam epitaxy
• Photon detectors made from niobium nitride nanowires, cooled by liquid helium and pumps
• Optical SMD components
• Bragg mirror

Wetware

Materials for making wetware life support board:

• Multilayer fiber-reinforced circuit board
• Polyacetic acid polymer scaffolds specifically made to handle live tissues
• PBI fluid pipes
• Petri Dish
• A pump
• A circuit
• Body serum liquid

Materials for making neuro processing unit:

• Wetware life support circuit board (skip etching step)
• Grown brain tissue from the final tiers of genetic engineering
• Neurochips for reading brain activity. These would be made of EOSFETs, which are MOSFETs except an electrolyte solution replaces the metal, to detect neuron activity.
• Glass tubes
• Insulating foils
• Some fine wires
• Soldering alloy

Materials for making wetware processor:

• Neuro processing unit
• Advanced SMD components (no crystal cpus or other cpus)
• Fine wires

Molecular Circuits

Gooware SMDs would be based on molecular-scale and nano-scale electronics:

• Transistors from quantum dots AKA cadmium selenide (chemistry chain for this is already implemented in GCYS)
• Inductors and resistors from molecular logic gates, which are very complex chemicals that would be put together with nanobots: https://en.wikipedia.org/wiki/Molecular_logic_gate
• Capacitors based on nanocellulose and carbon nanotubes: https://en.wikipedia.org/wiki/Nanocellulose#Bio-based_electronics_and_energy_storage
• Single-molecule diodes made from Tetraphenylporphyrin: https://en.wikipedia.org/wiki/Tetraphenylporphyrin

Fit silicene somewhere: https://en.wikipedia.org/wiki/Silicene#Silicene_transistors
Stuff to fill in gaps: https://en.wikipedia.org/wiki/Molecular_electronics#Molecular_materials_for_electronics

Cosmic Circuits

To fit the theme of this circuit, cosmic phenomenon such as neutron stars and perhaps black holes may be exploited for computational purposes. This section takes inspiration from this article: https://en.wikipedia.org/wiki/Limits_of_computation

Since the cosmic circuit is an item, it is unreasonable to fit a full size neutron star inside an item. Instead the circuit could be made from extremely dense computronium (AKA programmable matter). Another interesting idea is using extremely small black holes to store information or release information as they evaporate (if that's even possible) (this is probably just technobabble)

Supracausals

Zalgo will probably handle the supracausal circuit concept