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chore: a couple updates from design review
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- add DXF layer for board outline footprint
- remove copper restrict from under camera mounts
- move FFC x-0.4mm to align with camera board(was off previously)
- add parts for I2C0 ESD circuit to BOM
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oliver-rew-rigado committed Oct 26, 2020
1 parent f256e20 commit d3012eb
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